Srikanth
On 26 July 2021, the Intel Accelerated Event was held. During the event, Intel Corporation has revealed the procedural details and also the packaging technology roadmap. All the upcoming node technologies till 2025 have already been revealed.
RibbonFET, new process technology, has been officially unveiled by Intel, that is, new transistor architecture. In addition to this, Intel has also announced a new technology called PowerrVia. PowerVia is a next gen technology that uses backside power delivery.
Intel is simultaneously planning to swiftly adopt next-generation Extreme Ultraviolet Lithography (EUV) for the next generation of CPU. These CPUs will improvise energy efficiently. Intel is also announced to be the first in the industry to receive the High NA EUV (High Numerical Aperture) protocol tool.
As per the wordings of the CEO of the company, Intel is following the roadmap to be the performance leader by the year 2025.
Pat Gelsinger, the CEO of Intel revealed in a statement that, “The Company is working on its unparalleled pipeline of next gen innovation to deliver latest advanced technology advances from the transistor up to the high system level.”
Intel’s Roadmap to Upcoming Process Technologies
To simply replace the present 10nm SuperFin next gen technology, the new technology Intel 7 has been revealed. It is going to offer a 10%-15% of improvement in its performance per watt. Also, it is expected to confirm the shipment of Intel 7 technology on Alder Lake CPUs in 2021. This will register its seat in the production line by the end of this year.
Intel 4 will be the company’s first fabrication technology to completely utilize EUV technology. This technique relies on ultra-short wavelength light and will be offering a 20% of improvement in its performance per watt. This will register its seat in the production line by the end of this year and will land for sales in 2023.
An optimized version of FinFET is Intel 3. Intel 3 is set to offer an 18% of improvement in performance per watt when compared to Intel 4 technologies. CPUs that are based on Intel 3 fabrications will register their seat on the production line by the end of 2023.
Intel 20A will be the next-generation fabrication technology. Intel20A utilizes both RibbonFET and PowerVia technologies. It would be the first attempt from Intel to use a gate-all-around transistor. The design of Intel 20A is expected to launch by 2024. It has a partnership with Qualcomm.
The successor of Intel 20A is Intel 18A. The model will land on the market at the end of 2025. The processes like RibbonFET will be refined by this technology to get better energy efficiency. It is also yet expected to use next-generation High NA EUV.
